Sputtering Targets Manufacturer,Supplier™ Thin Film Coating | AbleTarget Limited®

Target Bonding

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Target Bonding

Nearly all PVD cathodes are water cooled. Depending on the requirements of the particular system and material you are using, your target material may have to be bonded to a copper, ss,molybdenum, or other metallic heat sink. The bonding process insures the thermal integrity of the interface between your system’s cooling assembly and the surface of the target, which experiences the most heat.

We strongly recommend that all ceramic sputtering targets be bonded.

Types of bonding(bonding materials)

There are two kinds of materials for bonding.

Indium metal-ordinary method for bonding

The most common target bond utilizes pure Indium metal as the bonding agent. This metal melts at 156o C which may limit the amount of power applied to a target during deposition

Silver Loaded

For applications that require a higher melting point than Indium, a silver loaded epoxy can be used.

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Welding methods between sputtering target and backing plate

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Welding methods between sputtering target and backing plate

Preparing tantalum target and backing plate,to add filler metal on the welding surface of backing plate;brazing in a vacuum environment, heating and the melting solder will be welded to backing plate and formating the target components; and make a insulation thermal diffusion treatment; cooling target components, and make mechanical processing to remove excess solder.
 
The invention is in the vacuum environment of the device,making a large area of welding, the welding metal surface can be effectively prevent oxidation,it is conducive to the infiltration of solder and metals, making the tantalum target and the binding strength between the back plate, resulting in sputtering process tantalum target to avoid the disengagement from the backing plate and get a normal sputtering.
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Sputtering Targets Manufacturer,Supplier™ Thin Film Coating | AbleTarget Limited®