Preparing tantalum target and backing plate,to add filler metal on the welding surface of backing plate;brazing in a vacuum environment, heating and the melting solder will be welded to backing plate and formating the target components; and make a insulation thermal diffusion treatment; cooling target components, and make mechanical processing to remove excess solder.

 

The invention is in the vacuum environment of the device,making a large area of welding, the welding metal surface can be effectively prevent oxidation,it is conducive to the infiltration of solder and metals, making the tantalum target and the binding strength between the back plate, resulting in sputtering process tantalum target to avoid the disengagement from the backing plate and get a normal sputtering.